ZSSC3015NE1B Integrated Device Technology WAFER (UNSAWN) - BOX | | | |
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ZSSC3136BA1D Integrated Device Technology DICE (WAFER SAWN) - WAFFLE PACK | | | |
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LT1025ACJ8 Analog Devices Inc./Maxim Integrated T.C. COLD JUNCTION COMPENSATOR | | | |
BD3896FV-FE2 ROHM Semiconductor IC SHOCK SENSOR PROCESSOR SSOP | | | |
ZSSC3131BA1D Integrated Device Technology DICE (WAFER SAWN) - WAFFLE PACK | | | |
ZSSC3123AA1C Integrated Device Technology DICE (WAFER SAWN) - FRAME | | | |
ZSSC3170EE1C Integrated Device Technology DICE (WAFER SAWN) - FRAME | | | |
LT1025CJ8 Analog Devices Inc./Maxim Integrated T.C. COLD JUNCTION COMPENSATOR | | | |